Recently, ARM Electronic Technology (Shanghai) Co., Ltd. and Nanjing Jiangbei New Area Administrative Committee signed a strategic cooperation agreement, marking another world-renowned integrated circuit company to settle in the new area.
According to the agreement, the two parties will create the globally-influential ARM Internet of Things Collaborative Innovation Center and the ARM China Innovation Education Center in the Jiangbei New Area Research and Innovation Park over the next five years, to help Jiangbei New Area build an integrated circuit industry cluster in new technology application, personnel training, and industrial cooperation. The two centers will become two super “processors” for the development of the integrated circuit industry in the Jiangbei New Area.
Headquartered in Cambridge, England, ARM is the world’s leading integrated circuit design company. Twenty six years after its establishment, ARM has become the world’s leading integrated circuit design intellectual property provider. The company’s products are widely used in mobile communications, mobile offices, intelligent sensing, wearing equipment, Internet of Things, data centers, big data management, cloud computing, artificial intelligence, and other fields. So far, ARM has over 1,300 ecosystem partners (authorized users of the company’s intellectual property). These partners have cumulatively shipped over 100 billion ARM-architecture integrated circuit chips.
Two years after the Jiangbei New Area was established, integrated circuit manufacturers such as TSMC and Tsinghua Unisplendour, and domestic and international leading integrated circuit design companies such as Spreadtrum, Vimicro, C-Sky, Empyrean, and ARM, have settled down in the new area. As a pilot program, Jiangbei New Area has set up the Nanjing Integrated Circuit Industry Service Center and a 50-billion-yuan industrial fund. Determined to build a 100-billion-yuan-level industrial cluster, Jiangbei New Area will continue to improve its integrated circuit industry chain, complete with chip design, wafer manufacturing, chip packaging, finished product testing, and terminal manufacturing, in an effort to build “China’s Chip City.”